Printed Circuit Board (PCB)
As a full service printed circuit board supplier, CEMS offers a complete line of products and services, from low-volume, quick-turn prototype manufacturing to medium- and high-volume production. We can provide a spectrum of product solutions engineered to meet virtually any requirement, ranging from single-sided through 20 layers.
CEMS experience in printed circuit board assembly enables us to provide the right approach for every requirement. Our carefully screened PCB assembly facilities utilize a range of sophisticated equipment and are staffed by highly trained personnel committed to a culture of continuous improvement.
We offer both conventional through-hole and state-of-the-art surface mount technologies. Our facilities have a solid track record in assembly and testing of a wide range of high complexity boards, including double-sided reflow, fine pitch and BGA technologies.
We also provide a warranty for both our boards and their value added components. Plus, with our years of experience and strategic U.S. and Far East manufacturing capabilities, you can realize significant cost savings – with the added convenience of dealing directly through local program managers.
Our PCB capabilities include:
- Lead-free compatible surface finish
- Rigid multi layers
- High Density Interconnect (or HDI) capability.
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TYPICAL VOLUME PRODUCTS
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| Specifications | IPC Class2, IPS Class3, Mil 31032 |
| Panel Size | 610 x 719 (24" x 28") |
| Materials | High-Tg Fr-4 (DriClad) |
| Layer Count | 2-18 |
| Thickness | 1.55mm-6.35mm (062"-250") |
| Mini Core Thickness | 0.1mm (0.004z0 incl cu Foil |
| Single Ply Core | Yes, with high yield process |
| Registration Budget | 125mm (0.005) min |
| Aspect Ratio | 14:1 |
| Min Drilled Via | 25mm (.010") min |
| Blind Via | 0.85:1 (mechanical and laser) |
| Finished Buried Via | 0.125mm (0.005") min |
| Min Lines Spaces Ext | 0.1mm/0.1mm (0.004"/0.004") |
